| PART |
Description |
Maker |
| 48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE
|
SMSC Corporation
|
| 48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| BC204VI BC214K BC213K BC173C BC153 BC209C BC209B B |
IC FLEX 6000 FPGA 10K 144-TQFP
Programmable Logic IC; Logic Type:Programmable; No. of Macrocells:102; Package/Case:144-TQFP; Leaded Process Compatible:No; Number of Circuits:1728
Programmable Logic IC; Logic Type:Programmable; No. of Macrocells:66; Package/Case:100-TQFP; Leaded Process Compatible:No; Number of Circuits:576
FPGA Logic IC; Logic Type:Programmable; No. of Macrocells:147; Package/Case:208-PQFP; Leaded Process Compatible:No; Number of Circuits:4992; Peak
Stratix II FPGA 180K FBGA-1020
Cyclone FPGA 6K FBGA-256
IC APEX 20KE FPGA 400K
Cyclone FPGA 3K TQFP-144 晶体管|晶体管|叩| 20V的五（巴西）总裁| 100mA的一（c）|06
|
Electronic Theatre Controls, Inc.
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SOT109-1 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
| SOP-8-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SOP-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
